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 E2D0040-39-22
Semiconductor MSM6597A-xxx
Semiconductor 3-Mbit Serial Voice ROM
This version: Feb. 1999 MSM6597A-xxx Previous version: May. 1997
GENERAL DESCRIPTION
The MSM6597A is a MSM6597 short TAT process version. The MSM6597A is a serial voice ROM with a 1,048,576-word 1-bit 3-bank configuration. The MSM6597A has a built-in internal address-generating circuit. A single, external clock input allows continuous, serial read operations. The internal addresses are automatically incremented by 1 by read operation. 1024 words in X direction and 1024 words in Y direction can be addressed by inputting external serial addresses. Banks are switched with CS1, CS2, and CS3. A read and playback device with predetermined messages can easily be configured by storing voice data into the MSM6597A and by combining it with one of Oki's recording and playback ICs and with one of Oki's serial registers. A serial register is required to drive the MSM6597A when used with the MSM6388 or MSM6588. (The MSM6597A does not operate without a serial register.) The major differences between the MSM6597A and MSM6597 are shown below. MSM6597A DC Characteristics
VDD = 3.5 to 5.5 V, Ta = -40 to +85C Parameter Current Consumption (1) Symbol IDD Condition tRDC = 2.5 ms Ta = -40 CS1 = CS2 = CS3 to +70C = VDD - 0.2 V Ta = -40 to +85C Min. -- -- -- Typ. 9 -- -- Max. 20 10 mA 50 Unit mA
Current Consumption (2)
IDS
MSM6597 DC Characteristics
VDD = 3.5 to 5.5 V, Ta = -40 to +85C Parameter Current Consumption (1) Current Consumption (2) Symbol IDD IDS Condition tRDC = 2.5 ms CS1 = CS2 = CS3 = VDD - 0.2 V Min. -- -- Typ. -- -- Max. 15 10 Unit mA mA
Typical values are at VDD = 5.0 V, Ta = 25C
For other detailes, refer to individual sections in this data sheet.
FEATURES
* Configuration * Serial access * Shorter-TAT processing * Power-supply voltage * Package options : 24-pin plastic SOP (SOP24-P-430-1.27-K) 30-pin plastic SSOP (SSOP30-P-56-0.65-K) : : : 1,048,576 words 1 bit 3 banks Read cycle time of 2.5 ms 5 V single supply (Product name : MSM6597A-xxxGS-K) (Product name : MSM6597A-xxxGS-AK) 1/9
Semiconductor
MSM6597A-xxx
BLOCK DIAGRAM
SADX
X-ADDRESS COUNTER
Sin
X-ADDRESS REGISTER
X-DECODER
10 1 2
10
Memory Cell Matrix 393216 x 8 VDD GND TEST TESTO1 TESTO2
SASX SADY
CK
LD CK
Y-DECODER
Y-ADDRESS COUNTER
Sin
Y-ADDRESS REGISTER
MULTIPLEXER
10
6 3
MULTIPLEXER DOUT
SASY TAS RDCK CS1 CS2 CS3
CK
LD CK
CS CONTROLLER
PIN CONFIGURATION (TOP VIEW)
SADY 1 SASY 2 CS2 3 CS1 4 NC 5 NC 6 NC 7 NC 8 SADX 9 SASX 10 TAS 11 VDD 12 NC : No connection 24-Pin Plastic SOP NC : No connection 30-Pin Plastic SSOP 24 23 22 21 20 19 18 17 16 15 14 13
GND CS3 DOUT TESTO1 NC NC NC NC NC RDCK TESTO2 TEST
SADY SASY CS2 NC CS1 NC NC NC NC NC NC SADX SASX TAS VDD
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
30 29 28 27 26 25 24 23 22 21 20 19 18 17 16
GND CS3 DOUT TESTO1 NC NC NC NC NC NC NC NC RDCK TESTO2 TEST
2/9
Semiconductor
MSM6597A-xxx
PIN DESCRIPTIONS
Pin SOP SSOP Symbol Type
Description Power supply pin. Insert a bypass capacitor of 0.1 mF or more between this pin and the GND pin. Ground pin (SERIAL ADDRESS) This pin inputs the starting X address of a read operation. Addressing in units of 1024 words is possible. The 1024-word address data can be input as 10-bit (AX0 - AX9) serial data via the SADX pin. (SERIAL ADDRESS) This pin inputs the starting Y address of a read operation. Addressing in units of 1024 words is possible. The 1024-word address data can be input as 10-bit (AY0 - AY9) serial data via the SADY pin. (SERIAL ADDRESS STROBE) This is the clock input pin which is used to store the serial address data of the X address into the device's internal register. (SERIAL ADDRESS STROBE) This is the clock input pin which is used to store the serial address data of the Y address into the device's internal register. (ADDRESS TRANSFER STROBE) This is the input pin for loading the serial address data into the internal address counter. The X and Y addresses are stored at the falling edge of TAS. (READ CLOCK) This is the clock input pin for reading information out of the data register. Internal operation starts at the falling edge of RDCK. The information in the data register is output on the DOUT pin. The internal address counter is automatically incremented by 1 at the falling edge of RDCK. (DATA OUT) The data output pin is always kept in a high-impedance state when CS1, CS2, and CS3 are all kept "H" or when RDCK is kept "H". This pin reflects the "H" or "L" level data being read, and the current data is hold until RDCH is asserted High. (CHIP SELECT) When either CS1, CS2, or CS3 is "L", bank 1, bank 2, or bank 3 is selected, respectively. Setting all three signals "H" disables all input and output pins. These pins enable parallel use of multiple serial voice ROMs by connecting the data output pins. Pin for testing. Apply "L" level. Pins for testing. Leave these pins open.
12 24 9
15 30 12
VDD GND SADX
-- -- I
1
1
SADY
I
10 2
13 2
SASX SASY
I I
11
14
TAS
I
15
18
RDCK
I
22
28
DOUT
O
4 3 23 13 21 14
5 3 29 16 27 17
CS1 CS2 CS3 TEST TESTO1 TESTO2 I O I
ABSOLUTE MAXIMUM RATINGS
Parameter Power Supply Voltage Input Voltage Storage Temperature Symbol VDD VIN TSTG Condition Ta = 25C Ta = 25C -- Rating -0.3 to +7.0 -0.3 to VDD+0.3 -55 to +150 Unit V V C
3/9
Semiconductor
MSM6597A-xxx
RECOMMENDED OPERATING CONDITIONS
Parameter Power Supply Voltage Operating Temperature Symbol VDD Top Condition GND=0V -- Range 3.5 to 5.5 -40 to +85 Unit V C
ELECTRICAL CHARACTERISTICS
DC Characteristics
VDD = 3.5 to 5.5 V, Ta = -40 to +85C Parameter "H" Level Input Voltage "L" Level Input Voltage "H" Level Output Voltage "L" Level Output Voltage "H" Level Input Current "L" Level Input Current Current Consumption (1) Symbol VIH VIL VOH VOL IIH IIL IDD Condition -- -- IOH = -40 mA IOL = 2 mA VIH = VDD VIL = GND tRDC = 2.5 ms CS1 = CS2 = CS3 = VDD - 0.2 V Ta = -40 to +70C Ta = -40 to +85C Min. 0.8xVDD -- VDD-0.3 -- -- -10 -- -- -- Typ. -- -- -- -- -- -- 9 -- -- Max. -- 0.8 -- 0.45 10 -- 20 10 mA 50 Unit V V V V mA mA mA
Current Consumption (2)
IDS
Typical values are at VDD = 5.0 V, Ta = 25C
AC Characteristics
VDD = 3.5 to 5.5 V, Ta = -40 to +85C Parameter CS, SAS Setup Time SASX, SASY Cycle Time SASX, SASY Precharge Time SASX, SASY Pulse Width Address Setup Time Address Hold Time TAS Setup Time TAS, RDCK Setup Time TAS Pulse Width Read Cycle Time Access Time Output Turn-off Delay Time RDCK Precharge Time RDCK Pulse Width Symbol tCSS tSSC tSAP tSAS tAS tAH tATS tTRS tTAS tRDC tACC tOFF tRDP tRD Min. 1000 500 250 250 100 100 500 500 250 2500 -- 0 1000 1500 Max. -- -- -- -- -- -- -- -- -- -- 1500 200 -- -- Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns
4/9
Serial Address Input Timing
TIMING DIAGRAMS
Semiconductor
CS1 (I)
CS2 (I)
, , , , ,,
CS3 (I) SADX (I) AX0 AX1 AX2 AX3 tAH tAS SASX (I) tSAS tSAP tCSS tSSC SADY (I) AY0 tAH AY1 AY2 AY3 tAS SASY (I) tSAS tSAP tCSS tSSC TAS (I)
, , ,,
AX9 tATS AY9 tATS
AX4
AX5
AX6
AX7
AX8
AY4
AY5
AY6
AY7
AY8
MSM6597A-xxx
tTAS
5/9
Read Access Timing
Semiconductor
TAS (I)
RDCK (I)
DOUT (O)
,,
tTAS tTRS tRDC tRD tRDP tOFF XnYm XnYm+1 XnYm+2 XnY1023 Xn+1Y0 Xn+1Y1 tACC
MSM6597A-xxx
6/9
Semiconductor
MSM6597A-xxx
APPLICATION CIRCUIT
MSM6588 Playback Storage Example
DVDD DVDD' AVDD
MICROCONTROLLER
VDD SAD SAS TAS RWCK WE DIN DOUT AU/D TEST TEST TEST TEST TEST CS CS1 CS2 CS3 CS4 SADX SASX TAS RDCK
VDD
MSM6389
RD WR CE MCUM TEST RSEL1 RSEL2 TEST TEST TEST TEST RESET
DOUT SASY SADY
MSM6588
GND
TEST CS1 CS2 CS3 GND
+
MIN MOUT LIN
MON XT XT
4.096 MHz DGND
AOUT
AVDD + + AGND
LOUT AMON FIN FOUT ADIN SG DGND
SPEAKER AMPLIFIER AGND
Note: When the MSM6597A is driven by the MSM6388 or MSM6588, a serial register is required. (The MSM6597A does not operate without it.)
3-Mbit SERIAL VOICE ROM MSM6597A-xxx
D3 D2 D1 D0
SAD SAS TAS RWCK WE DI/O
7/9
Semiconductor
MSM6597A-xxx
PACKAGE DIMENSIONS
(Unit : mm)
SOP24-P-430-1.27-K
Mirror finish
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 0.58 TYP.
Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person on the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
8/9
Semiconductor
MSM6597A-xxx
(Unit : mm)
SSOP30-P-56-0.65-K
Mirror finish
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 0.19 TYP.
Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person on the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
9/9
E2Y0002-29-11
NOTICE
1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. Neither indemnity against nor license of a third party's industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party's right which may result from the use thereof. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. No part of the contents cotained herein may be reprinted or reproduced without our prior permission. MS-DOS is a registered trademark of Microsoft Corporation.
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Copyright 1999 Oki Electric Industry Co., Ltd.
Printed in Japan


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